Wafer-level micropackaging in thin film technology for RF MEMS applications

Abstract

In this work, a thin-film packaging was developedto be used for radio-frequency microelectromechanicalsystem configurations. The fabricated packages aresuspended membranes in the multilayer SixNy/aSi/SixNy onconductive coplanar waveguides (CPWs) of differentlength. Several geometric parameters of the membranes,which are the length, the curvature radius at the vertices ofthe rectangular base, the density and the diameter of holeson the capping surface, were also varied. The mechanicalproperties of the suspended membranes were investigatedby mechanical simulations and surface profilometry measurementsas a function of the geometric parameters. RFcharacterization was performed to evaluate the impact ofthe package on the CPW performance. Finally, networkanalysis was carried out, allowing to clarify the origin ofthe RF losses measured for the fabricated microdevices.


Tutti gli autori

  • Persano A.; Siciliano P.; Quaranta F.; Taurino A.; Lucibello A.; Marcelli R.; Capoccia G.; Proietti E.; Bagolini A.; Iannacci J.

Titolo volume/Rivista

Microsystem technologies


Anno di pubblicazione

2017

ISSN

0946-7076

ISBN

Non Disponibile


Numero di citazioni Wos

Nessuna citazione

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Numero di citazioni Scopus

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Settori ERC

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Codici ASJC

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