Wafer-level micropackaging in thin film technology for RF MEMS applications
Abstract
In this work, a thin-film packaging was developedto be used for radio-frequency microelectromechanicalsystem configurations. The fabricated packages aresuspended membranes in the multilayer SixNy/aSi/SixNy onconductive coplanar waveguides (CPWs) of differentlength. Several geometric parameters of the membranes,which are the length, the curvature radius at the vertices ofthe rectangular base, the density and the diameter of holeson the capping surface, were also varied. The mechanicalproperties of the suspended membranes were investigatedby mechanical simulations and surface profilometry measurementsas a function of the geometric parameters. RFcharacterization was performed to evaluate the impact ofthe package on the CPW performance. Finally, networkanalysis was carried out, allowing to clarify the origin ofthe RF losses measured for the fabricated microdevices.
Autore Pugliese
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Persano A.; Siciliano P.; Quaranta F.; Taurino A.; Lucibello A.; Marcelli R.; Capoccia G.; Proietti E.; Bagolini A.; Iannacci J.
Titolo volume/Rivista
Microsystem technologies
Anno di pubblicazione
2017
ISSN
0946-7076
ISBN
Non Disponibile
Numero di citazioni Wos
Nessuna citazione
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Numero di citazioni Scopus
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Ultimo Aggiornamento Citazioni
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Settori ERC
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Codici ASJC
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