Scribe-cleave-passivate (SCP) slim edge technology for silicon sensors

Abstract

We are pursuing scribe-cleave-passivate (SCP) technology of making "slim edge" sensors. Such sensors have only a minimal amount of inactive peripheral region, which benefits construction of large area tracker and imaging systems. Key application steps of this method are surface scribing, cleaving, and passivation of the resulting sidewall. We are working on developing both the technology and physical understanding of the processed devices performance. In this paper we begin by reviewing the manufacturing options of SCP technology. Then we show new results regarding the technology automation and device physics performance. The latter includes charge collection efficiency near the edge and radiation hardness study. We also report on the status of devices processed at the request of the RD50 collaborators. (C) 2013 Elsevier B.V. All rights resented.


Autore Pugliese

Tutti gli autori

  • CREANZA D , et al.

Titolo volume/Rivista

NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH. SECTION A, ACCELERATORS, SPECTROMETERS, DETECTORS AND ASSOCIATED EQUIPMENT


Anno di pubblicazione

2013

ISSN

0168-9002

ISBN

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