Abstract

In recent years, the requirement of compact devices caused an increasing use of Surface Mount Technology. This technology guarantees the reduction of the size of electronic packages by exploiting solder joint interconnection technology. Nevertheless, parameter variations can occur during the deposition and printing of the soldering paste on a board, compromising its correct working. In this paper, it is proposed a fuzzy architecture for computing an index which provides a quantitative refined assessment about the quality of the soldered interconnections. This task is performed by reproducing the modus operandi of the human experts during their assessments. The proposed architecture consists of three modules connected in series: a feature extraction block and two fuzzy ones. The presented solution keeps the benefits of a neurofuzzy system previously proposed in literature, like the reduction of equipment and computational costs. Moreover, it implies two further advantages: the influence of the human experts in its design is reduced and its implementation is reasonable. Experimental results confirm such advantages, in fact, the architecture approximates the human assessments reliably.

Autore Pugliese

• Acciani Giuseppe

Tutti gli autori

• ACCIANI G , G. FORNARELLI , A. GIAQUINTO

Titolo volume/Rivista

IEEE TRANSACTIONS ON INDUSTRIAL INFORMATICS

Anno di pubblicazione

2011

ISSN

1551-3203

ISBN

Non Disponibile

Numero di citazioni Wos

Nessuna citazione

Ultimo Aggiornamento Citazioni

Non Disponibile

Numero di citazioni Scopus

15

Ultimo Aggiornamento Citazioni

2017-04-23 03:20:56

Settori ERC

Non Disponibile

Codici ASJC

Non Disponibile