Abstract

In this work we propose a new technological approach to fabricate a fully integrated three-axis Hall magnetic sensor. The three axial device fabrication process exploits microfabrication technologies applied to a GaAs-based heterostructure to obtain at the same time three mutually orthogonal sensors: an in-plane Hall sensor and two out-of-plane Hall sensors. A two dimensional electron gas (2DEG) AlGaAs/InGaAs/GaAs multilayered structure constitutes the sensing medium of the micromachined devices, whereas an underlying strained InGaAs/GaAs bilayer allows the self-positioning of the out-of-plane devices by virtue of sacrificial layer removal and strain release. The in-plane and out-of-plane Hall sensors, show an excellent linearity versus the magnetic field with an absolute sensitivity as high as 0.03 V/T at 0.6 V bias voltage.

Autore Pugliese

• De Vittorio Massimo

Tutti gli autori

• Sileo L. , Todaro M.T. , Tasco V. , De Vittorio M. , Passaseo A.

Titolo volume/Rivista

MICROELECTRONIC ENGINEERING

Anno di pubblicazione

2010

ISSN

0167-9317

ISBN

Non Disponibile

Numero di citazioni Wos

Nessuna citazione

Ultimo Aggiornamento Citazioni

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Numero di citazioni Scopus

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Ultimo Aggiornamento Citazioni

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Settori ERC

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Codici ASJC

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