Cooling of electronic devices: Nanofluids contribution

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Abstract

Cooling of electronic devices is one of the main challenge of new generation technology. The extreme miniaturization has high benefits, but the heat to be dissipated per unit of surface increases in uncontrolled way. In this paper the application of a new generation of heat transfer fluids, nanofluids, to electronic devices is analyzed. Even if the use of nanofluids is not still common, there are many papers that deal with this topic, reporting both experimental and theoretical results. The development of this technology could be one of the key elements that could give an important impulse to further miniaturization of electronic devices and at the same time increase their energy efficiency.

Autore Pugliese

Tutti gli autori

  • Colangelo G. , Favale E. , Milanese M. , De Risi A. , Laforgia D.

Titolo volume/Rivista

APPLIED THERMAL ENGINEERING

Anno di pubblicazione

2017

ISSN

1359-4311

ISBN

Non Disponibile

Numero di citazioni Wos

Nessuna citazione

Ultimo Aggiornamento Citazioni

Non Disponibile

Numero di citazioni Scopus

2

Ultimo Aggiornamento Citazioni

28/04/2018

Settori ERC

Non Disponibile

Codici ASJC

Non Disponibile